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Hot Chips

Hot Chips reviews the semiconductor industry's novel introductions and technological breakthroughs from startups.

The most recent reports are shown below:

HelloSoft Debuts Low Power IP Convergence Processor

HelloSoft launched of its ultra low-power IP Convergence Platform that is five times more power efficient than existing solutions. . . . Continue

Fresco Microchip Debuts Industry's First Fully Integrated Universal Legacy Demodulator and Digital IF Processor

Fresco Microchip, a developer of RF, mixed-signal and digital signal processing ICs, unveiled its breakthrough FM1100 worldwide legacy audio/video demodulator and multi-standard digital IF processor solutions for television broadcast reception. . . . Continue

Frontier Silicon Debuts Unified Multi-Region Digital Radio Receiver

Frontier Silicon will introduce a unified digital radio receiver module to work with all existing Band 3 and L-Band digital radio standards for Europe and Asia. . . . Continue

Redmere Debuts World' First 3.4Gbps HDMI Switch with Embedded CEC Controller

|tease start| |tease end| RedMere Technology, an Irish chip innovator for ultra low power interconnect announced the world's first High Definition Multimedia Interface (HDMI) switch and . . . Continue

Newport Media Debuts Single-Chip TV Chip for Mobile Market, Buys Korean Middleware Developer

Newport Media, a supplier of products to the mobile broadcast media market, began sampling the world's first complete single-chip solution for the MediaFLO™ mobile broadcast platform. . . . Continue

BitWave Launches Programmable Transceiver

Bitwave Semicnductor introduced the BW1102 Softransceiver(TM) RFIC, the world's first programmable CMOS RF transceiver. . . . Continue

DiBcom Debuts DVB-SH Chip

DiBcom, a provider of mobile TV solutions, is showcasing the world's first DVB-SH receiver, the company's latest innovation, at Mobile World Congress in Barcelona. . . . Continue

Quartics Demos "PC to TV" Wireless Solution at CES

Quartics, an Irvine, Calif. fabless semiconductor company, unveiled a reference design at CES 2008 based on its SoC chip which decodes and transmits a multimedia stream over a 802.11g wireless platform . . . Continue

MaxLinear Debuts CMOS IC Tuner for Global TV Standards

MaxLinear, a fabless semiconductor IC developer of CMOS-based broadband RF ICs for consumer markets, took the wraps off its MxL5007, a TV tuner IC that meets all global digital and analog cable and terrestrial TV standards. . . . Continue

Luxtera Introduces Industry's First 40G Optical Active Cable, World's First CMOS Photonics Product

Luxtera unveiled the industry's first 40 Gigabit optical active cable (OAC), Blazar, which is also the world's first CMOS photonics product. . . . Continue

Tzero Unveils New UWB Chipset for Home Entertainment Networking

Tzero Technologies announced its new ZeroWire chipset (TZC7200), the first WiMedia® standards-based, UWB semiconductor solution . . . Continue

SPI Claims Highest Performance DSP

Stream Processors (SPI), unveiled what it dubs is the industry's highest-performing DSP, the Storm-1™ SP16HP. As the newest member . . . Continue

Wintegra Launches Silicon/Software Solution for Mobile WiMAX Basestations

Wintegra launced the WinMax, a family of single chip processors and associated software for WiMAX basestation applications. . . . Continue

IBM Moves Moore's Law Into the Third-Dimension

IBM unveiled a chip stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. . . . Continue

Bay Microsystems and Enigma Semiconductor Team Up on Interoperability Supporting 40G and Beyond
Bay Microsystems, a network processor company and Enigma Semiconductor, a developer of switching silicon technology announced interoperability between Bay's Chesapeake 40G Network Processor and Enigma . . . Continue

Luxtera Unveils Germanium-Enabled Integrated Photodetector on Mainstream SOI-CMOS Wafer

Luxtera, a developer of silicon photonics technolotgy, is the first company to use a standard SOI-CMOS fabrication process, and by strategically adding pure germanium . . . Continue

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