Agreements and Marketing Alliances


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Agreements and Marketing Alliances

Agreements and Marketing Alliances reviews who is making agreements with whom (chipmakers, customers, IP firms) related to technology licenses, second-source agreements, co-marketing alliances, joint marketing pacts, and other significant deals.

The most recent reports are shown below:

INSIDE Secure Licenses Advanced ARM SecurCore Technology

INSIDE Secure is planning to provide 32-bit secure processor solutions based on the industry-leading ARM® architecture. Under the terms of a licensing agreement with ARM, INSIDE can now utilize the ARM SecurCore® SC300™ processor for its next generation of secure payments, digital security and NFC solutions. . . . Continue

GateRocket Teams With Altima for Japan Distribution

Citing strong overseas demand for its innovative verification and debug solutions for advanced FPGAs, GateRocket continues to build out its global sales and support network, announced an agreement with a leading independent Japanese distributor, Altima. . . . Continue

Toshiba Boosts Brazil's Bid to Expand Home Chip Industry

Toshiba is expanding its IC footprint in Brazil's expanding consumer market by tying up with one of the countries top research institutes. . . . Continue

Toshiba Ties Up With Brazilian Firm for IC Design
Toshiba is expanding its IC footprint in ?xml:namespace prefix = st1 ns = "urn:schemas-microsoft-com:office:smarttag . . . Continue

IMEC to House Kaneka's European Photovoltaics Lab

IMEC, Europe's leading nanoelectronics research center, and Kaneka Corporation, the leading Japanese manufacturer of chemical specialties and solar cells, entered into a bilateral cooperation. . . . Continue

Mirics and Shanghai HDIC in Partnership to Deliver HD Broadcast TV to Portable Platforms in China

Mirics Semiconductor and Shanghai High Definition Digital Technology Industrial Company Ltd (HDIC), formed a strategic partnership to enable high-definition digital TV reception on portable devices using the Digital Television Terrestrial Broadcast (DTTB) standard. DTTB. . . . Continue

STM, SOITEC in Image Sensor Pact

STMicroelectronics (NYSE:STM) and Soitec (Euronext:SOI) announced an exclusive joint cooperation between the two companies that will lead to the development of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products. . . . Continue

Dolphin and SMIC Set Partnership for Portable Media Players

Semiconductor Manufacturing International Corporation (NYSE:SMI), the leading and the most advanced fab in China, and Dolphin Integration, a developer of virtual components for high resolution audio applications, entered into a partnership for the release of the latest generation of digital-to-analog audio converters that, utilizing Dolphin's expertise, feature ultra-low power consumption. . . . Continue

Nokia Advances Stratetic Projects With Qualcomm Pact
Nokia and (Nasdaq: QCOM) are planning to work together to develop advanced UMTS mobile devices, initially for North America. The companies intend for the devices to be based on S60 software on Symbian . . . Continue

NEC, Elmos Team Up in Broad Alliance